APICAL is a ultra-heat-resistant polyimide film that has been developed through our own studies using a wealth of our unique high polymer technologies.
Miniaturization and more advanced features of information and telecommunication devices.
Used in electronic materials such as those for cellular phones, HDD wireless suspensions, and optical pickups.
High Performance in Cutting-edge Technology
Used in materials for satellites and superconductor facilities by taking advantage of superior heat and low-temperature resistance and radiation-resistance characteristic
Insulating Coating Materials Used to Support the Social Infrastructure
Used as insulating coating material for wires, cables, motors, and power generators used for airplanes, railroad trains, and other critical applications
|Tensile Strength||MPa||300||ASTM D882, 20°C|
|Elongation at Break||%||75||ASTM D882, 20°C|
|Conefficient of Thermal Expansion||ppm/°C||16||T.M.A. 100 ~200°C|
|Heat Shrinkage||MD||%||0.08||200°C, 2hr IPC-TM-650 2.2.4Method A|
|Water Absorption||%||2.8||ASTM D570, 20°C 24hr|
|Dielectirc Constant||–||3.3||IPX-TM-650 126.96.36.199,1MHz|
|Volume Resistivity||Ω•cm||>10¹⁶||ASTM D257, 500V,20°C|
|Dielectric Strength||kV||8(25μm)||ASTM D149, 60Hz,20°C|
|Glass Transition Point||°C||Nil||Dynamic Thermomechamometric analysis|
|High heat resistance over a long period of time UL Temperature Index(Mechanical)||°C||200||UL746B|
|High heat resistance over a long period of time UL Temperature Index(Electrical)||°C||240||UL746B|
|Thickness(μm)||APICAL AH||APICAL NPI|
● APICAL AH – General Grade
● APICAL NPI – Superior dimensional stability grade