Polyimide Film

APICAL is a ultra-heat-resistant polyimide film that has been developed through our own studies using a wealth of our unique high polymer technologies.

Skin

Excellent combination of mechanical, physical, and electrical properties in a broad range of temperatures

High heat resistance over a long period of time

Excellent flame resistance

Foam

Superior dimensional stablility

Isotropically controlled properties

Miniaturization and more advanced features of information and telecommunication devices.

Used in electronic materials such as those for cellular phones, HDD wireless suspensions, and optical pickups.

High Performance in Cutting-edge Technology

Used in materials for satellites and superconductor facilities by taking advantage of superior heat and low-temperature resistance and radiation-resistance characteristic

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Insulating Coating Materials Used to Support the Social Infrastructure

Used as insulating coating material for wires, cables, motors, and power generators used for airplanes, railroad trains, and other critical applications

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Typical Properties

Item Unit Apical NPI Method
Tensile Strength MPa 300 ASTM D882, 20°C
Elongation at Break % 75 ASTM D882, 20°C
Conefficient of Thermal Expansion ppm/°C 16 T.M.A. 100 ~200°C
Heat Shrinkage MD % 0.08 200°C, 2hr IPC-TM-650 2.2.4Method A
TD 0.02
Water Absorption % 2.8 ASTM D570, 20°C 24hr
Dielectirc Constant 3.3 IPX-TM-650 2.5.5.3,1MHz
Volume Resistivity Ω•cm >10¹⁶ ASTM D257, 500V,20°C
Dielectric Strength kV 8(25μm) ASTM D149, 60Hz,20°C
Glass Transition Point °C Nil Dynamic Thermomechamometric analysis
Flammability V-O UL94
High heat resistance over a long period of time UL Temperature Index(Mechanical) °C 200 UL746B
High heat resistance over a long period of time UL Temperature Index(Electrical) °C 240 UL746B

Grade

Thickness(μm) APICAL AH APICAL NPI
10
12.5
25
50
75
125

APICAL AH – General Grade
APICAL NPI – Superior dimensional stability grade